MANUFACTURE OF WIRING BOARD

摘要

PURPOSE:To separate a binder layer from a ceramic substrate so that a very low-cost and various kinds of board shapes by baking after a binder layer is formed on a ceramic substrate and overlaid with insulative layers and conductor layers alternately to form a wiring layer. CONSTITUTION:First, a layer 2b made of a compound having a sintering temperature higher than that of a binder layer 2a or a wiring layer 5 is formed on a ceramic substrate 1. Next, insulative layers 3 and conductor layers 4 are piled up alternately by necessary times to form a wiring layer 5. A wiring board can be obtained by sintering at a predetermined temperature after a predetermined wiring layer is formed on the ceramic substrate 1. After baking, the wiring layer 5 is separated from the ceramic substrate 1. This is because of the presence of the binder layer 2a or compound layer 2b: even a large area wiring board undergoes uniform separation, so that a wiring layer is formed.