SEMICONDUCTOR DEVICE AND PACKAGE MOLDING METHOD THEREOF AS WELL AS MOLDING DEVICE USED FOR THE SAME

摘要

PURPOSE:To enable the consumption of the molding material during the resin sealing package molding step to be cut down by a method wherein the gate traces of resin sealing package are to be positioned either on the main surface opposite to that of a semiconductor pellet or on the main surface in the opposite side. CONSTITUTION:A semiconductor device 28 is provided with a semiconductor pellet 22 with an electronic circuit integrated with the main surface thereof, multiple leads 19 electrically connected to the pellet 22 to be externally extended and a package 25 resin sealing the pellet 22 and the parts of respective leads 19. In such a semiconductor device 28 wherein the resin sealing package 25 is molded by pressure molding step, the gate traces 27 during the pressure molding step are to be positioned at least either on one main surface opposing to that of the semiconductor pellet 22 or on the main surface in the opposite side in the resin sealing package 25. Furthermore the gate traces 27A during the pressure molding step are to be formed on the outer peripheral edge of the main surface in the side whereon the gate traces 27 are positioned.