| 摘要 |
PURPOSE:To provide a lead frame suitable for making a semiconductor device smaller and thinner, by improving quality and reliability in heat-resistance, stress, and so on. CONSTITUTION:A die pad of a lead frame in a semiconductor device is made of a flexible insulating board. The flexible insulating board is connected to a supporting lead in a semiconductor-device mounting part. While the die pad 1 made of a flexible insulating board is connected to the lead frame through a tab-suspending pin 2, a semiconductor element 3 is mounted on the die pad and connected to an inner lead 5 through a wire 4. In this case, since the thermal expansion coefficient of the die pad is almost equal to that of sealing resin, inner stress between the rear or front face corners of the die pad and the sealing resin can be reduced. Also, the die pad is hardly oxidized, and a defect, such as a crack or flaking in the semiconductor device can be prevented. Moreover, a short circuit between the die pad and a wire 4 caused by a floating state of the die pad can be prevented.
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