| 摘要 |
PURPOSE: To provide a new bare die carrier for testing a semiconductor circuit. CONSTITUTION: A carrier includes a substrate 16 for regulating an aperture and an external periphery part, plural I/O pads 36 arranged on the peripheral part and a wiring circuit including the composite of plural individual conductors 34 formed on a polymer dielectric and the wiring circuit is extended over the aperture and arranged on the top surface of the substrate so as to form a flexible thin film over the aperture. The device includes also plural die contact pads connected to the conductors, capable of depositing particles on them and arranged around a flexible thin film, a fence 23 erected from the thin film and having size capable of receiving a test die 22, a top cap 12 to be applied to the surface of the die when the die is received in the fence, a bottom cap 14 brought into contact with the bottom of the substrate, and a clamping tool arranged between dies and capable of fixing the top cap 12 on the bottom cap 14. |
