| 摘要 |
PURPOSE:To achieve the miniaturization and thinning of an apparatus containing an infrared-ray sensor element. CONSTITUTION:A semiconductor device, wherein an infrared-ray sensor element is mounted, is constituted of the infrared-ray sensor element 1 and the following parts. In a driving LSI bare chip 13, the infrared-ray sensor element 1 is mounted on the upper surface through bump electrodes 23, the infrared-ray sensor element 1 is driven and the output signal of the element 1 is processed. The driving LSI bare chip 13 is mounted on the upper surface of a stem 5 through die-bond paste 8. Terminals 6 are made to penetrate through the stem 5 and held and connected to the driving LSI bare chip 13 with bonding wires 9. The stem 5 is fixed to the lower opening of an approximately tubular inside- protecting cap 10. A filter 11 is fixed to the upper opening of the cap 10. The infrared-ray sensor element 1 and the driving LSI bare chip 13 are made to form the unitary body and contained in one package. Therefore, the mounting density of a printed board is improved, and the apparatus can be miniaturized and thinned. |
