| 摘要 |
PURPOSE:To obtain a wiring substrate of high continuity reliability and excellent surface smoothness by a method wherein a plurality of laminated boards each consisting of a first conductor layer and a second conductor layer the insulative layer and a part of which are electrically bonded to the first conductor layer piled up one after another are bonded and piled up via a bonding layer and electrically connected via through-holes. CONSTITUTION:A multilayered wiring substrate is so constituted that a plurality of laminated boards 20, 21 each consisting of, for example, three or four piled up conductor layers are piled up via a bonding layer 8, so that a high multilayered wiring board can be manufactured in a short time. The problem that ruggedness by via-hole parts increases as the number of layers becomes larger can be relieved, and this ruggedness can be absorbed by the bonding layer with the result that surface smoothness improves. The intermediate part is reinforced by the bonding layer 8 and the board 1. Further, the bonding layer 8 reduces a difference in the coefficient of thermal expansion between second conductor layers 6 and mounted components and absorbs thermal stress in the case of silicon base, thereby improving continuity reliability. |
