| 摘要 |
PURPOSE:To manufacture the semiconductor device having pad aperture parts capable of providing reliable and excellent moisture proofing effect without exposing a passivation PSG film in an inner wall with high precision in simple steps. CONSTITUTION:Within the semiconductor device provided with pad aperture parts 5 for exposing pad electrodes 1 in a passivation film to laminatedly form a PSG film 3 and an Si3N4 film 4 in this order, sidewall surface layers 8 to be residually formed by etching back the second Si3N4 film 7 laminated on the Si3N4 film 4 are provided. Furthermore, the sidewall surface layers 8 are to be formed by etching back the second Si3N4 film 7 until the surfaces of the pad electrodes 1 are exposed in the bottom parts of the pad aperture parts 5. |
