| 摘要 |
PURPOSE:To improve adhesive properties between both an optical semiconductor element and a silver paste and both the optical semiconductor element and a sealing resin, and to prevent the generation of peeling on an interface, defective lighting, etc., by treating the optical semiconductor element with a specific sulfur-containing compound. CONSTITUTION:A IIIB-VB compound optical semiconductor element surface- treated with a mercaptan, thiazole, sulfene amide or thiuram sulfur-containing compound is mounted by a resin composition. Consequently, the functional group of the sulfur-containing compound has high reactivity with silver paste and the epoxy group of an epoxy resin as the main component of a transparent sealing resin, has excellent affinity with a metallic frame, and can be fast stuck sufficiently even when stress is applied to an element interface, thus preventing defective conduction by the generation of peeling. The adhesive properties of a sulfur-containing compound treating surface and the sealing resin can also be improved similarly in addition to enhancement in adhesion with silver paste. |
