Power module

摘要

In the case of a power module having a power section and a control section, the semiconductor components of the power section and of the control section are accommodated on separate supporting bodies which are arranged one above the other. The power section has exclusively encased semiconductor components whose casing lower side is arranged on a first supporting body on one side; the control section has components arranged on one side or both sides, on a second supporting body. The two supporting bodies are connected to one another via the connecting pins of the encased semiconductor components of the power section.