HIGH POWER DISSIPATING PACKAGES WITH MATCHED HEATSPREADER HEATSINK ASSEMBLIES

摘要

A removable heatsink assembly comprised of a heatsink unit (10) and a heatspreader (9) is provided. The heatsink unit (10) has at least one fin (3) and a coupling collar (4) for radiating heat away from a packaged electronic device (11). The heatspreader (9) includes a platform (8) attached to an inner collar (14) in thermal contact with the packaged electronic device (11). The platform (8) has one or more tabs (7) suitable for mating with one or more flanges (5) located on the coupling collar (4) of the heatsink unit (10). Coupling grooves (6) within the flanges (5) engage the platform (8) of the heatspreader (9) when the flanges (5) are mated with the heatspreader tabs (7) and the heatsink (10) is turned. The heatsink (10) can therefore be quickly and conveniently attached to or removed from the heatspreader (9). The present invention thus permits a wide variety of different heatsinks (10) to be interchangeably used with a single heatspreader (9) attached to an electronic device package (11).