发明名称 |
APPARATUS AND METHOD FOR MACHINING CONDUCTIVE STRUCTURES ON SUBSTRATES |
摘要 |
The present invention is an apparatus and method for machining a laminate structure (10) to form a selected shape. The method includes forming a first layer (26) on a substrate (24). A first protective structure (12) is defined that is attached to each of the first layer (26) and the substrate (24). At least a portion of the protective structure (12) has the selected shape. The laminate structure (10) is then machined along the first protective structure (12) thereby forming at least a portion of a selected shape. |
申请公布号 |
WO9419726(A1) |
申请公布日期 |
1994.09.01 |
申请号 |
WO1994US02185 |
申请日期 |
1994.02.24 |
申请人 |
CERIDIAN CORPORATION |
发明人 |
PAI, DEEPAK, KESHAV |
分类号 |
H01L21/48;H05K3/00;H05K3/46;(IPC1-7):G03F9/00 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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