发明名称 APPARATUS AND METHOD FOR MACHINING CONDUCTIVE STRUCTURES ON SUBSTRATES
摘要 The present invention is an apparatus and method for machining a laminate structure (10) to form a selected shape. The method includes forming a first layer (26) on a substrate (24). A first protective structure (12) is defined that is attached to each of the first layer (26) and the substrate (24). At least a portion of the protective structure (12) has the selected shape. The laminate structure (10) is then machined along the first protective structure (12) thereby forming at least a portion of a selected shape.
申请公布号 WO9419726(A1) 申请公布日期 1994.09.01
申请号 WO1994US02185 申请日期 1994.02.24
申请人 CERIDIAN CORPORATION 发明人 PAI, DEEPAK, KESHAV
分类号 H01L21/48;H05K3/00;H05K3/46;(IPC1-7):G03F9/00 主分类号 H01L21/48
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