| 摘要 |
<p>PURPOSE:To prevent defective external form of an IC card, in an IC card wherein a module substrate is embedded in a frame member composed of a synthetic resin, by forming a protrusion on either one of the mutually opposed surfaces of the module substrate and the frame member so as to come into contact with the other surface. CONSTITUTION:An IC card has a module substrate 4 formed by attaching electric parts 2 and a connector 3 to a circuit board 1 and the module substrate 4 is embedded in a frame member 7 formed from a synthetic resin and both surfaces of the frame member 7 are covered with over-sheets. In this constitution, protrusions 7a are formed to either one of the opposed surfaces of the module substrate 4 and the frame member 7, for example, to the opposed surface of the frame member 7 so as to come into contact with the other opposed surface, for example, to the opposed surface of the module substrate 4. By this constitution, for example, when thermal deformation is generated in the frame member 7 during the assembling of the IC card, the protrusions 7a are brought into contact with the module substrate 4 to suppress the thermal deformation of the frame member 7 to prevent defective external form of the IC card.</p> |
