发明名称 |
Semiconductor device with an airtight space formed internally within a hollow package |
摘要 |
This invention relates to a package construction of a semiconductor device, and provides a semiconductor device in which a vapor-impermeable moistureproof plate is embedded in a bottom surface of a hollow package or an inner surface wallthicknesswise therefrom to provide an excellent moisture-proofness in terms of the package construction.
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申请公布号 |
US5343076(A) |
申请公布日期 |
1994.08.30 |
申请号 |
US19930155539 |
申请日期 |
1993.11.22 |
申请人 |
MITSUI PETROCHEMICAL INDUSTRIES, LTD. |
发明人 |
KATAYAMA, SHIGERU;TOMINAGA, KAORU;YOSHITAKE, JUNICHI |
分类号 |
H01L23/00;H01L23/057;H01L23/495;(IPC1-7):H01L23/48;H01L23/02;H01L23/12;H01L29/40 |
主分类号 |
H01L23/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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