Package connector apparatus

摘要

A package connector apparatus of the SMT type which eliminates a discontinuous point in characteristic impedance to assure a good high frequency transfer characteristic and is compatible with another package connector apparatus of the through-hole dip type. A printed circuit board has a plurality of wiring patterns formed on each of the opposite first and second faces thereof, and a connector body is mounted on the first face of the printed circuit board with the center thereof displaced to the first face side of the printed circuit board and has first and second faces formed thereon. A plurality of contacts are mounted in a plurality of rows on and extend from the first and second faces of the connector body. The contacts extending from the first face are connected at the other end portions thereof to the wiring patterns on the first face of the printed circuit board while the other contacts extending from the second face of the connector body are connected at the other end portions thereof to the wiring patterns on the second face of the printed circuit board.