| 摘要 |
PCT No. PCT/JP92/00201 Sec. 371 Date Oct. 22, 1992 Sec. 102(e) Date Oct. 22, 1992 PCT Filed Feb. 25, 1992 PCT Pub. No. WO92/15045 PCT Pub. Date Sep. 3, 1992.A method of preparing a negative type pattern of a polyimide film is provided which includes applying to a substrate a sufficient amount of a photosensitive polymer composition to form a negative type pattern, the photosensitive polymer composition comprising a mixture of a poly(amido)imide precursor containing a repeating unit represented by the following formula (I), at least one kind of quinonediazide compound and an organic solvent: carbocyclic aromatic group or heterocyclic group; R2 is an aliphatic group having at least two carbon atoms, an alicyclic group, an aromatic aliphatic group, a carbocyclic aromatic group, a heterocyclic group or a polysiloxane group; X is -O- or NR5-, where R5 is a hydrogen atom or a monovalent organic group having 10 or less carbon atoms; R3is a divalent organic group; R4 is a hydrogen atom or a monovalent organic group having 20 or less carbon atoms; Ar is a hexavalent or decavalent organic group represented by the formula <IMAGE> <IMAGE> <IMAGE> k is an integer of 1</=k</=5, and j+k+1 is equal to the valence of Ar; m is independently 1 or 2; n is independently 0 or 1 and the values of m and n are in the range of 1</=m+n</=2; prebaking the composition at 50 DEG -130 DEG C.; irradiating the composition through a mask with actinic radiation to form an irradiated composition; developing the irradiated composition with a developing solution comprising a basic solution of a basic substance in a solvent comprising 0 to 10 parts by weight of water and 100 to 90 parts by weight of a water-soluble organic solvent to remove unexposed portions of the composition and form a negative type pattern; rinsing and drying the pattern; and post-baking the pattern at 200 DEG -500 DEG C.
|
