Method of fabricating integrated circuit module

摘要

An integrated circuit module having microscopic self-alignment features comprises: 1) an integrated circuit chip having a plurality of input/output pads in a pattern on a surface thereof; 2) an interconnect member having a surface which includes input/output pads in a pattern that matches the pattern of pads on the integrated circuit chip; and, 3) one of the surfaces has a predetermined number of holes of one-half to fifty mils deep and the other surface has a predetermined number of protrusions of one-half to fifty mils high which are shaped to fit into the holes and prevent the surfaces from sliding on each other when the input/output pads on both of the surfaces are aligned.