| 发明名称 |
Method for electroplating metal onto a non-conductive substrate treated with basic accelerating solutions for metal plating |
| 摘要 |
Novel aqueous accelerating solutions and methods for their use in connection with metal plating of dielectric materials are disclosed and claimed. The accelerating solutions are mildly basic aqueous solutions including dilute concentrations of copper ions.
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| 申请公布号 |
US5342501(A) |
申请公布日期 |
1994.08.30 |
| 申请号 |
US19920968853 |
申请日期 |
1992.10.30 |
| 申请人 |
HARNDEN, ERIC F. |
发明人 |
OKABAYASHI, KIYOSHI |
| 分类号 |
C25D5/54;H05K3/18;H05K3/42;(IPC1-7):C25D5/00 |
主分类号 |
C25D5/54 |
| 代理机构 |
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| 主权项 |
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| 地址 |
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