PROCESS FOR REINFORCING A SEMICONDUCTOR WAFER AND A REINFORCED SEMICONDUCTOR WAFER.

摘要

A process is used for reinforcing a semiconductor wafer (7), where remaining bubbles in a hot-melt adhesive can be reduced in number and in size. A reinforced wafer adhering to a reinforcing plate (5) with a heated and softened adhesive (6) is kept in a lower ambient pressure than a standard atmosphere for a predetermined period for deaeration, and is cooled under a higher pressure than the deaeration pressure. A reinforcing plate has a groove on its adhering face.