发明名称 Encapsulated contact material and process for producing the same.
摘要 <p>An encapsulated contact material comprising a substrate and a contact-coating layer formed on said substrate, characterized in that said contact-coating layer comprises at least one metal selected from a group consisting of Mo, Zr, Nb, Hf, Ta and W or an alloy made of two or more of these metals and containing from 0.5 to 10 atomic % of at least one element selected from a group consisting of Li, K, Ce, Cs, Ba, Sr, Ca, Na, Y, La, Sc, Th and Rb and has a thickness of 0.1 mu m or more; or comprises at least one metal selected from a group consisting of Mo, Zr, Nb, Hf, Ta and W or an alloy made of two or more of these metals and containing from 0.1 to 5 % by weight of at least one oxide comprising at least one metal selected from a group consisting of Li, K, Ce, Cs, Ba, Sr, Ca, Na, Y, La, Sc, Th and Rb and has a thickness of 0.1 mu m or more. This encapsulated contact material has a low contact resistance and an excellent arc resistance.</p>
申请公布号 EP0612085(A2) 申请公布日期 1994.08.24
申请号 EP19940301074 申请日期 1994.02.15
申请人 THE FURUKAWA ELECTRIC CO., LTD. 发明人 OZAKI, MASANORI, C/O THE FURUKAWA;MURATA, HIDEAKI, C/O THE FURUKAWA;OHASHI, YOSHIKAZU, C/O THE FURUKAWA
分类号 C23C14/06;C23C14/16;C23C16/06;C23C16/30;C23C30/00;H01H1/02;(IPC1-7):H01H1/02;C23C14/02;C23C14/58;C23C16/02;C23C16/56 主分类号 C23C14/06
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