| 摘要 |
A heat sink (10) comprising a thin plate (20) made of a heat conducting material, which plate includes a series of small tapered chimneys (30) extending therethrough, the plate being adapted to fit over and parallel to an entire circuit board (40), thermally connecting with the semiconductors (50) on the board, the chimneys being spaced inbetween the semiconductors and facilitating natural or forced airflow from the area between the plate and the printed circuit board to the area outside by means of the low pressure drop created by their tapering, the heat sink taking very little vertical space in the electronics package including the printed circuit board while providing effective heat dissipation and shielding from electro-magnetic radiation and/or radio frequency interference for the semiconductors on the board. <IMAGE> |
