Method for making ferrite chip bead array

摘要

A method for making a ferrite chip bead array in which a plurality of reinforcing outer electrodes are formed at the upper and lower surfaces of a ferrite substrate structure having a pair of substrate sheets and a plurality of uniformly spaced conductive leads interposed between the substrate sheets to enhance the bonding force between each electrode and each corresponding inner conductive lead, as well as the bonding force between each outer electrode and each corresponding inner conductive lead as well as the bonding force between each outer electrode and the ferrite substrate structure. The reinforcing outer electrodes eliminate a tendency for outer electrodes to short-circuit from the ferrite substrate upon placement of the chip bead array on a circuit board. The subject method simplifies manufacture and prevents short circuit, thereby enhancing reliability and productivity.