IC PACKAGE AND ITS WIRING CONNECTING METHOD,申请号JP19930044685-传众专利搜索

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发明名称	IC PACKAGE AND ITS WIRING CONNECTING METHOD
摘要
申请公布号	JPH06236939(A)	申请公布日期	1994.08.23
申请号	JP19930044685	申请日期	1993.02.08
申请人	SUMITOMO KINZOKU CERAMICS:KK	发明人	OBA AKIRA;KAWAMURA SHIGEKI;TAKAMICHI HIROSHI
分类号	H01L23/12;(IPC1-7):H01L23/12	主分类号	H01L23/12
代理机构		代理人
主权项
地址

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