发明名称 Thermoplastic moulding compounds of polyamides and resin copolymers
摘要 This invention relates to thermoplastic moulding compounds with improved properties, in particular with reduced water absorption and rigidity and improved impact strength, from polyamides A and a thermoplastic resin copolymer B containing at least one (meth)acrylic acid ester of a tertiary alcohol in quantities of up to 35% by weight in addition to the other monomers such as styrene or (meth)acrylic esters. The invention also relates to rigid moulding compounds which are tough at low temperatures and are obtained from polyamides and the thermoplastic resin copolymers defined above and in addition contain a rubber polymer C in quantities of up to 35% by weight.
申请公布号 US5340876(A) 申请公布日期 1994.08.23
申请号 US19930088415 申请日期 1993.07.07
申请人 BAYER AKTIENGESELLSCHAFT 发明人 WESTEPPE, UWE;STRUSS, KLAUS;LINDNER, CHRISTIAN;IDEL, KARSTEN-JOSEF;LAUE, HANS-JOACHIM
分类号 C08L77/00;(IPC1-7):C08L77/00;C08L33/06;C08L25/14 主分类号 C08L77/00
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