MANUFACTURE OF MULTILAYER PRINTED BOARD AND INSULATION LAYER MOLDING COMPOSITION

摘要

PURPOSE:To acquire enough adhesion strength between an electroless metal plating film and an insulation layer by laminating a conductor circuit comprised of an electroless metal plating film and an electric insulation layer alternately by using an insulation layer molding composition acquired by dispersing specific soluble resin particle to photosensitive resin which enables formation of an insoluble film. CONSTITUTION:An insulation layer molding composition wherein soluble resin whose SP value is smaller by at least 1 or more than an SP value of photosensitive resin which enables formation of an insoluble film is applied to a printed wiring board wherein a conductor circuit is formed and is dried. Then, it is exposed and hardened in accordance with a pattern. Thereafter, a part wherein film formation composition is not hardened is dissolved and removed to form 21 pattern of an insulation layer and is heated to completely harden the pattern. Resin particle is dissolved and removed to roughen a surface of an insulation layer by dissolving and removing resin particle by treatment liquid which dissolves resin particle without dissolving hardened photosensitive resin practically. Electroless plating is applied to the surface and a conductor circuit is formed.