| 摘要 |
<p>PURPOSE:To provide a solder plating device which is applicable to various sized and various shaped semiconductor devices by providing a supporting member with a reflecting part which reflects solder plating liquid reaching a lead through a channel and permitting a part including the reflecting part to be removed. CONSTITUTION:A bottom received table 1 and a bottom receiving table 2 are covered with an outer frame and channel 1c which guides solder plating liquid is formed. The bottom receiving table 1 and the bottom receiving table 2 are separated and the bottom receiving table 1 is permitted to be narrower as it reaches the center from the both edges having the part 1b to be the narrowest. The surface of the part 1b is permitted to function as a reflecting part which reflects the solder plating liquid, which comes to the top from the bottom, to leads 6 and 6. Since only the bottom receiving table 1 at the top among the separated two bottom receiving tables 1 and 2 is permitted to be removed, the solder plating device can be applies to IC packages of various specifications for general use.</p> |
