| 摘要 |
<p>PURPOSE:To realize compactness by bending a wiring conductor wherein one of multilayer substrates is shaped to an extension and connected to an inside wiring conductor to form an external connection terminal electrode. CONSTITUTION:A plurality of ceramic substrates 3 are piled and laminated with one ceramic substrate 2 placed in a second layer from above. A part wherein the ceramic substrate 2 of the second layer projects is bent to cover an edge part of a lower surface of a ceramic substrate of a lower layer along a laminated side surface and to expose an end edge part of a terminal electrode conductor to the lower surface. After it is pressurized at a high temperature, the entirety is burnt. Lastly, a wiring conductor 1 for mounting a chip part is formed on an upper surface of a ceramic substrate of an uppermost layer. Compactness can be realized in this way.</p> |
