发明名称 |
Process of removing soldering flux and/or adhesive tape residue from a substrate |
摘要 |
Disclosed is an industrial cleaning process in which a contaminant comprising soldering flux and/or adhesive tape residue is removed from a substrate contaminated therewith. The process comprises the steps of contacting the substrate with a terpene-based cleaning composition which is substantially free of water-soluble organic material; removing the composition and solubilized contaminant from the substrate by contact with water having a temperature of about 70 DEG F. to about 140 DEG F. for a period of time of no longer than about 10 minutes to provide a substrate having a contamination rating of no greater than about 14 micrograms NaCl equivalent/square inch (MIL-P-28809A), and to thereby form a mixture comprising the composition, contaminant and water. The process also comprises separating the water from said mixture, the separated water being substantially free of water-soluble organic material and having a chemical oxygen demand of no greater than about 1,000 ppm.
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申请公布号 |
US5340407(A) |
申请公布日期 |
1994.08.23 |
申请号 |
US19920896051 |
申请日期 |
1992.06.09 |
申请人 |
PETROFERM INC. |
发明人 |
BOLDEN, PAUL L.;HAYES, MICHAEL E. |
分类号 |
B41N3/06;C11D3/18;C11D3/20;C11D3/43;C11D7/24;C11D7/26;C11D7/50;C11D11/00;C23G5/024;C23G5/032;G03F7/42;H05K3/26;(IPC1-7):B08B3/08 |
主分类号 |
B41N3/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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