LEAD FRAME AND ELECTRONIC COMPONENT MOUNTING BOARD

摘要

PURPOSE:To deal with the demand for high performance and multilayer electronic component mounting device by surely preventing the shorting of a plurality of divided islands. CONSTITUTION:A lead frame Lf1 is provided with three islands 5a-5c. The adjacent islands 5a-5c are connected at three points by temporarily connecting parts 6 which are to be removed after lamination. An electronic component mounting board 9 is provided by removing the connecting part 6 by drilling after laminating the lead frame Lf1 and insulating material 1 and 2.