Apparatus and method for solder paste printing process for printed circuit boards

摘要

Apparatus for indicating a predetermined snap-off between a circuit board and a stencil in a solder paste printing process for printed circuit boards. The apparatus includes a triangular shaped plate having a lever member, where a portion of the lever member extends through a stencil hole for engaging the circuit board. The plate further includes two support members for resting on top of the stencil. The centroid of the weight of the plate is between the two support members and the lever member to urge the plate to pivot about the two support members. On the end opposite the two support members is an indicator cone for indicating the predetermined snap-off of the circuit board relative to the stencil. Advantageously a method for positioning the stencil and the circuit board at a predetermined snap-off during the solder paste printing process for printed circuit boards is also disclosed.