| 摘要 |
PURPOSE: To provide a method of manufacturing with simplified processes, a semiconductor device which can assure to restrain low facility investment and manufacturing cost. CONSTITUTION: This manufacturing method includes a process for eliminating a surface protection film 5 after forming an electrode pad 3 and a surface protection film 5 on the semiconductor substrate to form an aperture 7 by exposing the electrode pad 3, a process for forming a barrier metallic layer 9 at the upper part of the exposed electrode pad 3, a process for arranging solder balls 15 at the upper part of the barrier metallic layer 9 of the semiconductor substrate, using a first metallic mask 13 on a magnet 11 to form a solder bump electrode 17 on the electrode pad 3, a process for forming a wiring pattern between elements by coating a conductive paste between bump electrodes 17, using a second metallic mask 19 on the semiconductor substrate where the solder bump electrode 17 is formed on the magnet 11 and the process for forming a protection layer which is sealed by the molding resin. |
