| 摘要 |
PURPOSE: To enable flattening sufficiently smoothly, even in the case of the relatively deep groove-like structures arranged on a semiconductor substrate with a simple method by selectively packing a prepolymer into the groove-like structures and curing the prepolymer, then swelling the prepolymer. CONSTITUTION: The polymer adhesive 14 is packed via a supply reservoir during the V-shaped lead-in of the groove-like structures 14, etched into the semiconductor substrate 10. The packed polymer adhesive 24 is cured, i.e., polymerized. in the next working stage. The polymn. depends upon the material of the polymer adhesive 24, and the polymer adhesive is exposed to the irradiation with UV-rays over the entire surface or is heated to a prescribed polymn. temp. The polymer adhesive 24, cured and shrunk in the groove-like structures 14, is chemically swollen in the ensuing stage, by which the residual depth is at least compensated or is excessively compensated, as shown in the Figure. Consequently, projecting parts S are generated in the regions of the groove-like structures 14, and in either case, a capacity increase is attained together with the swelling and the groove-like structures 14 are surely packed. |
