| 摘要 |
PURPOSE:To detect the position of a cutting line on a semiconductor wafer and to judge whether its detection result is proper pr not. CONSTITUTION:The image of a semiconductor wafer 11 is picked up, its image information is taken into and image-processed by a computer 2, and the position of a cutting line is detected. The apparatus has a feature that its detection result is displayed by a display device 6 such as a printer or the like and the operator can judge whether the detection result is proper or not. As the display form of the detection result, it is preferable that the image of the cutting line is formed on the basis of positional information which has been detected and that the image is displayed on a CRT or the like so as to be superposed on the original image of the semiconductor wafer. |
