| 摘要 |
PURPOSE:To enable a highly reliable bonding corresponding to the large-sizes of semiconductor chip subjected to die bonding. CONSTITUTION:As the essential components the followings are used: (A) tetravalent organic acid components using 50mol% or more of biphenyl ether tetracarbonic acid components, and 50 to 99mol% of diamine compound such as 2,2-bis 4-(4-aminophenoxy)phenyl propane, polyimide resin of diamine components composed of 50 to 1mol% of bis (gamma-aminopropyl)tetramethyl disyloxane, being condensated; and (B) conductive powder. |
