| 摘要 |
PURPOSE:To obtain the deflecting scanning device whose driving IC never rises greatly in temperature by providing a heat absorption member which is large in thermal capacity and/or heat conductivity on the rear face of the mount part of a metallic substrate for the driving IC. CONSTITUTION:On the top surface of the metallic substrate 20, the driving IC 22 is soldered through pins 23 and on the rear face of the metallic substrate 20, the heat absorption member 24 which is made of aluminum is adhered at a position corresponding to the part below the driving IC 22. When a motor device 11 is powered ON, the driving IC 22 generates heat, the major part of which is conducted to the metallic substrate 20 through the pins 23 and further easily conducted to the heat absorption member 24 through the metallic substrate 20 since the metallic substrate 20 is a thin plate type. This heat absorption member 24 has enough thermal capacity and heat conductivity as compared with the metallic substrate 20, so the heat of the driving IC 22 is easily diffused by the heat absorption member 24 to suppress the temperature rise of the driving IC 22. |
