| 摘要 |
PURPOSE:To enable a multilayer printed wiring board to be enhanced in wiring density by a method wherein an insulating layer in which a blind hole is bored is made to contain the deposition catalyst of electroless plating, and material which turns the blind hole electrically conductive is formed through electroless plating. CONSTITUTION:A glass epoxy copper plated laminate board is used as an inner material, and a required circuit pattern is provided on the laminate board for the formation of an inner board 6. Then, two pieces of inner board 6 are made to overlap each other interposing a catalyst-loaded glass epoxy prepreg 7a and a catalyst-free glass epoxy prepreg 2b vertically between them to form a laminate, and an electrolytic copper foil is provided for both sides of the laminated board, which is thermocompressed into a laminated board 10 provided with a required inner circuit. Then, a blind hole 1 and a through-hole 2 are bored in the laminated board 10. Burrs are removed from the holes 1 and 2, the insides of the holes 1 and 2 are cleansed, the board 10 are subjected to a surface cleaning, a soft etching, a catalyst attaching, and an adhesion accelerating treatment, then the board 10 is dipped into an electroless plating solution to form an electroless plating layer on the inner walls of the holes 1 and 2. Lastly, a required outermost circuit is formed, and thus a multilayer printed wiring board can be obtained. |
