| 摘要 |
PURPOSE:To make it possible to quantitatively correct the warp of the surface of a substrate by fixing the substrate of a thin film magnetic head provided on the upper portion of a lifting part which moves up and down in the hollow part of a support base for the substrate. CONSTITUTION:A thin film magnetic head substrate 1 placed on a substrate support base 2 has an upward warp due to the difference in the thermal expansion coefficient between the substrate and the film while forming a film. A lifting base 10 for mounting the substrate has a press-fitted pin 11, is inserted from a groove 12 at the center of the lifting part 15 and changes its direction in the hollow 14 in the lifting part 15 by go-degree angle, and the lifting base 10 for mounting a substrate and the lifting part 15 are connected with a certain degree of freedom. A very small downward linear movement of the lifting base 10 for mounting a substrate has an effect to correct the warping thin film magnetic head substrate 1 to be of a flat shape, thereby allowing flattening that has reprocibility and substantially contributes to the yield ratio of the products. |
