MULTILAYER PRINTED WIRING BOARD

摘要

PURPOSE:To provide a multilayer printed wiring board which is excellent in shielding and heat dissipating properties and provided with a wiring board where a high frequency signal circuit and a power control circuit are built. CONSTITUTION:A circuit is formed on the upside and/or the underside of a metal board through the intermediary of an insulating adhesive layer, and a high frequency wiring board is provided in one piece at a required position on the side of the metal board where the circuit is formed for the formation of a multilayer printed wiring board.