| 摘要 |
PURPOSE:To obtain a multilayer printed wiring board wherein thermoplastic resin is used as insulating base material, and a through-hole connection excellent in reliability can be obtained by a method wherein a second concentric through- hole is bored in a region where conductive composition is filled into a first connection through-hole, and a metal plating layer is formed on the inner wall of the second concentric through-hole. CONSTITUTION:A first through-hole 2 is bored in a laminate, a conductive composition 4 is filled into the through-hole 2. On the other hand, a land pattern 3a is formed around the through-hole 2 and dried out. A second through-hole 5 is concentrically bored in a region where the conductive composition 4 is filled into the first through-hole 2. That is, the inner wall of the second through- hole 5 is turned electrically conductive as a whole, and the vicinity of the opening (end face) of the second through-hole 5 is electrically connected to the land pattern 3a. Thereafter, by electroless plating, a plating layer is deposited on the inner wall of the second through-hole 5 and the land pattern 3a around the opening (end face) for the formation of a multilayer printed wiring board. |
