| 摘要 |
PURPOSE:To reduce the amount of wire swimming without lowering wiring quality by maintaining the film thickness and the melt viscosity of an adhesive resin layer within a specific range. CONSTITUTION:This wiring board is constituted by forming an adhesive resin layer on an insulating board by coating, sliding an insulating electrode 2 over the adhesive resin layer and simultaneously bonding it thereto to form a wiring pattern, and then heating and pressing the insulating board to bury it into the adhesive resin layer for fixation, and making a through-hole 3 through the insulating electrode 2, and metallizing the inner part of the through-hole 3, where the film thickness of a bonding agent sheet is maintained within a range of from 50mum to 100mum and at the same time the melt viscosity at 100 deg.C is maintained within a range of from 10<4> PaS to 10<5> PaS. Thereby, the wire holding ability after precured is increased, wire swimming generated by flush press is reduced and at the same time to obtain the same wiring quality as that with a conventional adhesive resin. |
