发明名称 BONDING WIRE INSPECTION SYSTEM
摘要 PURPOSE:To provide a bonding wire inspection system which can inspect the shape of wire loop accurately. CONSTITUTION:A coaxial illuminating section 21 illuminates the top part of a bonding wire 63 brightly. An image pick up section 22 picks up light reflected immediately above the wire 63. An oblique illuminating section 31 illuminates the wire 63 obliquely from above thus illuminating the top part of the wire 63 brightly. The image pick up section 22 picks up the light projected from the oblique illuminating section 31 and reflected on the top part of the wire 63. A first image data memory means 40 stores an image data corresponding to the output signal from the image pick up section 22. A detecting section 43 detects the three-dimensional position on the top of the wire 63 using the image data. An inspection section 44 inspects the shape of the bonding wire 63 based on the three-dimensional position data on the top of the wire 63.
申请公布号 JPH06229729(A) 申请公布日期 1994.08.19
申请号 JP19930015713 申请日期 1993.02.02
申请人 FUJITSU LTD 发明人 OSHIMA YOSHITAKA;TSUKAHARA HIROYUKI;ANDO MORITOSHI;FUSE TAKASHI
分类号 G01B11/24;H01L21/60;H01L21/66 主分类号 G01B11/24
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