| 摘要 |
PURPOSE:To manufacture a multilayer printed wiring board provided with a blind viahole and a through-viahole excellent in physical and electric properties by a method wherein a part of a copper foil correspondent to a viahole is etched at the same time when an insulating layer is dissolved. CONSTITUTION:After a through-hole 10 is provided, the surface of a copper wiring pattern 6 of an inner panel 7 is subjected to a blackening treatment. Then, a copper foil sheet 1 composed of a first insulating layer 2, a second insulating layer 3, and a copper foil 4 is laminated on both sides of the inner panel 7. Then, the spots of the copper foil 7 correspondent to viaholes 8 and 17 are etched to make the copper wiring pattern 6 exposed under the viahole 8, a blind viahole 9 is formed, the second insulating layer 3 filled into a through- hole 10 is fully dissolved to finish forming a viahole 17 as an access hole. The first and the second insulating layer, 2 and 3, are hardened, then silver paste is filled into the blind viahole 8 and the through-hole 17 by printing for the formation of a multilayer printed wiring board. |
