| 摘要 |
PURPOSE:To provide a manufacturing method of a semiconductor device which can prevent the not-yet filling and the floating and sinking of a die pad at the time of molding, and a lead frame which is used in the manufacturing method. CONSTITUTION:In a method for molding a package body of a semiconductor device, a gutter type recess (runner) is formed in a lower mold 20 B out of upper and lower molds 20A, 20B, and, via the runner, sealing resin is made to flow into a first gate 22 which communicates with a lower mold cavity 21B. A part of the sealing resin which has flown into the first gate 22 is introduced, via an aperture 16 formed in the load frame 10, to a second gate 23 formed in the upper mold 20A. The sealing resin is simultaneously injected in the upper and the lower cavities 21A, 21B, via the first and the second gates 22, 23. |
