| 摘要 |
Conventionally, solid-state imager chips are packaged in ceramic IC packages. In accordance with the invention, unpackaged imager chips are bonded to a light transmissive carrier having an area substantially larger than the area of the imager chip. The light transmissive carrier both firmly supports the imager chip and includes a metallization pattern which contacts the imager chip and provides for its electrical connections to external drive and signal processing circuitry. In a preferred embodiment, the photosensitive side of a thinned-substrate solid-state imager chip is directly bonded to the exit port of a prism. The prism exit port has the metallization pattern formed thereon and includes edge connectors at its periphery for connecting to the external circuitry. |
