发明名称 MOUNTING STRUCTURE FOR THERMOCOMPRESSION-BONDED TERMINAL
摘要 PURPOSE:To obtain a mounting structure for a thermocompression-bonded terminal on which the cutting of the conductor wire, constituting the flexible printed board and the like on the connection part which is the weak point of the thermocompression-bonding method heretofore in use in connection of two connecting objective substances using a flexible printed board or a flexible flat cable, is prevented. CONSTITUTION:In this thermocompression-bonded structure with which an electrode 2 and a conductor wire are electrically connected by thermocompression bonding of a flexible board 5, which is formed by coating a resin layer on the circumference of the conductor wire, on the electrode 2 arranged along the edge of a printed substrate 1, the resin 6 where the above- mentioned thermocompression bonding is performed does not include the edge of the electrode on the above-mentioned electrode, and also the area of the part 6a, where the electrode of the outside of the electrode row is not present, is made wider.
申请公布号 JPH06232525(A) 申请公布日期 1994.08.19
申请号 JP19930039545 申请日期 1993.02.03
申请人 TOYO COMMUN EQUIP CO LTD 发明人 AMANO KAZUYUKI
分类号 H01R4/02;H05K1/14;H05K3/36 主分类号 H01R4/02
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