| 摘要 |
PURPOSE:To provide a thin semiconductor device in stable high quality having no possibility of short-circuit between a lowered bonding loop and a bus bar within a LOC structured semiconductor chip wherein an inner lead is bonded onto the wiring side chip surface through the intermediary of an insulating film. CONSTITUTION:In a LOC structured semiconductor chip, a flame coated film 6 comprising an insulator with a thickness exceeding 1mum is formed both on the surface and the side of a bus bar 4. |
