| 摘要 |
PURPOSE:To surely eliminate flowing-out resin which leaks out at the time of resin molding process of a resin molded type semiconductor integrated circuit device, at the time of resin molding. CONSTITUTION:At the position clamping the lead part of a lead frame 1, through holes 5, 6 are formed between leads of an upper mold 3 and a lower mold 4. At the time of resin molding, pressure fluid is applied to the through holes 5, 6 of the both molds 3, 4, and flowing-out resin which leaks out from a gap between the leads of the lead frame 1 is blown away and eliminated. |
