发明名称 SEMICONDUCTOR LASER CHIP BONDING ORIENTATION ADJUSTING DEVICE AND AUTOMATIC DIE-BONDING DEVICE
摘要 <p>PURPOSE:To stabilize the optical axis of a laser beam, and to enhance the yield of products by shifting a semiconductor laser chip for correction of the deviation amount with respect to the reference axis of the position of light emission and the angle of irradiation. CONSTITUTION:The laser beam of a semiconductor laser chip 1 is projected on a screen 3, it is converted into an image signal by an image-input part 4 and sent to an image processing part 6. Also, the image in front of the semiconductor laser chip 1 is inputted by a CCD camera 5, and its image signal is also sent to the image processing part 6. By measuring the center of distribution of laser beam from the image sent from an image input part 4 and also by measuring the position of the point of emitted light from the image sent from the CCD camera using the image processing part 6, the position of light-emitted point and the angle of irradiation are detected. A control part 7 gives an instruction to a semiconductor laser adjusting stage 8 pertaining to the amount of deviation from the reference position of light- emitting part and irradiation angle which were set in advance. Based on the instruction, the irradiation angle is adjusted by the control part 7 using the light emitting point as the reference position.</p>
申请公布号 JPH06232507(A) 申请公布日期 1994.08.19
申请号 JP19930017597 申请日期 1993.02.04
申请人 SHARP CORP 发明人 ICHIKAWA MASAMI;IWAMOTO TAKASHI;HARADA TOKUMI
分类号 H01L21/52;H01L21/68;H01S5/00;(IPC1-7):H01S3/18 主分类号 H01L21/52
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