| 摘要 |
<p>A process for forming a positive polyimide pattern which comprises forming a coating of a actinic-ray-sensitive polyimide precursor composition on a substrate, exposing the coating to actinic rays selectively, treating the resultant coating so that the unexposed area will be more highly hardened than the exposed area, and removing the coating of the exposed area. The invention process has brought about such an unexpected effect that a positive polyimide pattern can be formed by using the conventional actinic-ray-sensitive polyimide precursor composition that has been primarily used for forming a negative polyimide pattern. This process can provide readily a positive polyimide pattern having excellent performance.</p> |
