发明名称 A FLEXIBLE DEVICE FOR ENCAPSULATING ELECTRONIC COMPONENTS
摘要 <p>The present invention relates to a device for flexibly encasing electronic circuitry, where an electronic circuit (1) is enclosed in a casing which comprises a laminate (2) consisting of metal and plastic sheets such as to form a diffusion impervious and electrically conductive structure which prevents harmful substances from reaching the electronic circuit (1) and also prevents inductive electromagnetic exchange. Electrical conductors (3) pass through the joint region (4) of the laminate (2).</p>
申请公布号 WO1994018815(A1) 申请公布日期 1994.08.18
申请号 SE1993000107 申请日期 1993.02.11
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