| 摘要 |
A method of forming an environmentally sealed transponder type circuit wherein the circuit components are mounted on a lead frame type substrate (10; 31; 31'), the components are encapsulated in a plastic housing (28; 48) in a plastic molding process so that the housing is supported in the frame only by a plurality of the leads (39, 40; 39', 40'; 39', 40', 51, 52), andthen severing the leads at the periphery of the housing (28; 48) to provide a leadless package. The frame may be formed of a conductive material (10), an insulating material or as a printed circuit board (30; 50). A printed circuittype lead frame (31') whereby a coil (44) of the circuit may be mechanically attached and directly secured to the frame is additionally disclosed. |
